350 x 5 mm (T), Flatness tolerance: 0.01 mm

Devices for semiconductor-manufacturing equipments Ex. The dummy wafer or electrostatic chucks

Aluminum nitride has properties of  high heat resistant, high heat conductivity, excellent heat equalization and electrical insulation. ALN substrate film is used for mainly semiconductor manufacturing devices, and also it can be used for vacuum evaporation system, sputtering machines and CVD devices.